N-channel FETs and MOSFETs

N-channel transistor, PCB soldering, ITO-220AB, 55V, 64A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 55V. Drain Current Id [A] @ 25°C: 64A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI3205PBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.008 Ohms @ 34A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 43 ns. Ciss Gate Capacitance [pF]: 4000pF. Maximum dissipation Ptot [W]: 63W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 5.1A, 7.2A, 250uA, 0.27 Ohms, TO-220FP, TO-220 FULLPAK, 100V. ID (T=100°C): 5.1A. ID (T=25°C): 7.2A. Idss (max): 250uA. On-resistance Rds On: 0.27 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220 FULLPAK. Voltage Vds(max): 100V. C(in): 360pF. Cost): 150pF. Channel type: N. Quantity per case: 1. Trr Diode (Min.): 130 ns. Type of transistor: MOSFET. Function: DC/DC voltage converter. Id(imp): 29A. IDss (min): 25uA. Pd (Power Dissipation, Max): 37W. Td(off): 19 ns. Td(on): 8.8 ns. Technology: third-generation power MOSFET transistor. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. Drain-source protection : no. G-S Protection: yes

N-channel transistor, PCB soldering, ITO-220AB, 100V, 7.2A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 100V. Drain Current Id [A] @ 25°C: 7.2A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI520GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.27 Ohms @ 4.3A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 8.8 ns. Switch-off delay tf[nsec.]: 19 ns. Maximum dissipation Ptot [W]: 37W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C. Ciss Gate Capacitance [pF]: 360pF

N-channel transistor, PCB soldering, ITO-220AB, 100V, 9.7A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 100V. Drain Current Id [A] @ 25°C: 9.7A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI530GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.16 Ohms @ 5.8A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 8.6 ns. Switch-off delay tf[nsec.]: 34 ns. Ciss Gate Capacitance [pF]: 670pF. Maximum dissipation Ptot [W]: 42W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, PCB soldering, ITO-220AB, 100V, 17A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 100V. Drain Current Id [A] @ 25°C: 17A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI540GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.077 Ohms @ 10A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 11 ns. Switch-off delay tf[nsec.]: 53 ns. Ciss Gate Capacitance [pF]: 1700pF. Maximum dissipation Ptot [W]: 48W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 14A, 20A, 250uA, 0.052 Ohms, TO-220FP, TO-220 FULLPAK, 100V. ID (T=100°C): 14A. ID (T=25°C): 20A. Idss (max): 250uA. On-resistance Rds On: 0.052 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220 FULLPAK. Voltage Vds(max): 100V. C(in): 1400pF. Cost): 330pF. Channel type: N. Quantity per case: 1. Trr Diode (Min.): 170 ns. Type of transistor: MOSFET. Function: High-speed switching. Id(imp): 110A. IDss (min): 25uA. Number of terminals: 3. Pd (Power Dissipation, Max): 54W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 44 ns. Td(on): 8.2 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. Drain-source protection : yes. G-S Protection: no

N-channel transistor, 4.1A, 6.5A, 250uA, 0.4 Ohms, TO-220FP, TO-220F, 200V. ID (T=100°C): 4.1A. ID (T=25°C): 6.5A. Idss (max): 250uA. On-resistance Rds On: 0.4 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 200V. C(in): 800pF. Cost): 240pF. Channel type: N. Drain-source protection : diode. Quantity per case: 1. Trr Diode (Min.): 170 ns. Type of transistor: MOSFET. Id(imp): 36A. IDss (min): 25uA. Marking on the case: IRFI630G. Number of terminals: 3. Pd (Power Dissipation, Max): 35W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 39 ns. Td(on): 9.4 ns. Technology: Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. G-S Protection: no

N-channel transistor, PCB soldering, ITO-220AB, 200V, 5.9A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 200V. Drain Current Id [A] @ 25°C: 5.9A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI630GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.4 Ohms @ 3.5A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 9.4 ns. Switch-off delay tf[nsec.]: 39 ns. Ciss Gate Capacitance [pF]: 800pF. Maximum dissipation Ptot [W]: 32W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, PCB soldering, ITO-220AB, 200V, 9.8A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 200V. Drain Current Id [A] @ 25°C: 9.8A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI640GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.18 Ohms @ 5.9A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 45 ns. Ciss Gate Capacitance [pF]: 1300pF. Maximum dissipation Ptot [W]: 40W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 3.6A, 5.7A, 250uA, 0.55 Ohms, TO-220FP, TO-220F, 400V. ID (T=100°C): 3.6A. ID (T=25°C): 5.7A. Idss (max): 250uA. On-resistance Rds On: 0.55 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 400V. C(in): 1100pF. Cost): 190pF. Channel type: N. Quantity per case: 1. Trr Diode (Min.): 380 ns. Type of transistor: MOSFET. Function: Ultra Low Gate Charge. Id(imp): 23A. IDss (min): 25uA. Note: Viso 2500V. Number of terminals: 3. Pd (Power Dissipation, Max): 40W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 25 ns. Td(on): 11 ns. Technology: Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 30 v. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. Drain-source protection : yes. G-S Protection: no

N-channel transistor, PCB soldering, ITO-220AB, 400V, 5.4A, 0.55 Ohms 40W. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 400V. Drain Current Id [A] @ 25°C: 5.4A. Housing (JEDEC standard): 0.55 Ohms 40W. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI740G. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.55 Ohms @ 3.2A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 54 ns. Ciss Gate Capacitance [pF]: 1370pF. Maximum dissipation Ptot [W]: 40W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 0.85 Ohm 40W, TO-220-F, 2.9A, 4.6A, 250uA, 0.85 Ohms, TO-220FP, TO-220F, 500V, 500V. On-resistance Rds On: 0.85 Ohm 40W. Housing: TO-220-F. ID (T=100°C): 2.9A. ID (T=25°C): 4.6A. Idss (max): 250uA. On-resistance Rds On: 0.85 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 500V. Drain-source voltage (Vds): 500V. Channel type: N. Type of transistor: MOSFET power transistor. Max drain current: 4.6A. Type of transistor: MOSFET. G-S Protection: diode. Id(imp): 18A. IDss (min): 25uA. Number of terminals: 3. Pd (Power Dissipation, Max): 40W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 55 ns. Td(on): 14 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V

N-channel transistor, PCB soldering, ITO-220AB, 500V, 4.6A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 500V. Drain Current Id [A] @ 25°C: 4.6A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFI840GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.85 Ohms @ 2.8A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 55 ns. Ciss Gate Capacitance [pF]: 1300pF. Maximum dissipation Ptot [W]: 40W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 1.1A, 1.7A, 500uA, 4.4 Ohms, TO-220FP, TO-220F, 600V. ID (T=100°C): 1.1A. ID (T=25°C): 1.7A. Idss (max): 500uA. On-resistance Rds On: 4.4 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 600V. C(in): 350pF. Cost): 48pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 290ms. Type of transistor: MOSFET. Id(imp): 6A. IDss (min): 100uA. Number of terminals: 3. Pd (Power Dissipation, Max): 30W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 30 ns. Td(on): 10 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) min.: 2V. G-S Protection: no

N-channel transistor, 1.5A, 2.5A, 500uA, 2.2 Ohms, TO-220FP, TO-220F, 600V. ID (T=100°C): 1.5A. ID (T=25°C): 2.5A. Idss (max): 500uA. On-resistance Rds On: 2.2 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 600V. C(in): 660pF. Cost): 86pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 400 ns. Type of transistor: MOSFET. Id(imp): 10A. IDss (min): 100uA. Number of terminals: 3. Pd (Power Dissipation, Max): 35W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 35 ns. Td(on): 11 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) min.: 2V. Function: Switching. G-S Protection: no

N-channel transistor, 2.2A, 3.5A, 500uA, 1.2 Ohms, TO-220FP, TO-220F, 600V. ID (T=100°C): 2.2A. ID (T=25°C): 3.5A. Idss (max): 500uA. On-resistance Rds On: 1.2 Ohms. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 600V. C(in): 1300pF. Cost): 160pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 470ms. Type of transistor: MOSFET. Id(imp): 14A. IDss (min): 100uA. Number of terminals: 3. Pd (Power Dissipation, Max): 40W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 55 ns. Td(on): 13 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) min.: 2V. G-S Protection: no

N-channel transistor, PCB soldering, ITO-220AB, 900V, 1.9A. Housing: PCB soldering. Housing: ITO-220AB. Drain-source voltage Uds [V]: 900V. Drain Current Id [A] @ 25°C: 1.9A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRFIBF30GPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 3.7 Ohms @ 1.1A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 90 ns. Ciss Gate Capacitance [pF]: 1200pF. Maximum dissipation Ptot [W]: 35W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 0.024 Ohms, 22A, 31A, 31A, TO-220FP, TO-220F, 55V. On-resistance Rds On: 0.024 Ohms. ID (T=100°C): 22A. ID (T=25°C): 31A. Idss (max): 31A. Housing: TO-220FP. Housing (according to data sheet): TO-220F. Voltage Vds(max): 55V. Channel type: N. Quantity per case: 1. Type of transistor: MOSFET. Function: N MOSFET transistor. Pd (Power Dissipation, Max): 45W. Assembly/installation: PCB through-hole mounting. Technology: HEXFET Power MOSFET

N-channel transistor, PCB soldering (SMD), SOT-223, 55V, 1.9A. Housing: PCB soldering (SMD). Housing: SOT-223. Drain-source voltage Uds [V]: 55V. Drain Current Id [A] @ 25°C: 1.9A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: FL014N. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.16 Ohms @ 1.9A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 6.6 ns. Switch-off delay tf[nsec.]: 12 ns. Ciss Gate Capacitance [pF]: 190pF. Maximum dissipation Ptot [W]: 2.1W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, PCB soldering (SMD), SOT-223, 60V, 2.7A. Housing: PCB soldering (SMD). Housing: SOT-223. Drain-source voltage Uds [V]: 60V. Drain Current Id [A] @ 25°C: 2.7A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: FA. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.2 Ohms @ 1.6A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 10 ns. Switch-off delay tf[nsec.]: 13 ns. Ciss Gate Capacitance [pF]: 300pF. Maximum dissipation Ptot [W]: 3.1W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 2.3A, 2.8A, 250uA, 0.075 Ohms, SOT-223 ( TO-226 ), SOT-223, 55V. ID (T=100°C): 2.3A. ID (T=25°C): 2.8A. Idss (max): 250uA. On-resistance Rds On: 0.075 Ohms. Housing: SOT-223 ( TO-226 ). Housing (according to data sheet): SOT-223. Voltage Vds(max): 55V. C(in): 400pF. Cost): 145pF. Channel type: N. Quantity per case: 1. Trr Diode (Min.): 35 ns. Type of transistor: MOSFET. Function: High-speed switching. Id(imp): 11.2A. IDss (min): 25uA. Equivalents: IRFL024NPBF. Number of terminals: 3. Pd (Power Dissipation, Max): 2.1W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Td(off): 22.2 ns. Td(on): 8.1 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. Drain-source protection : yes. G-S Protection: no

N-channel transistor, PCB soldering (SMD), SOT-223, 55V, 2.8A. Housing: PCB soldering (SMD). Housing: SOT-223. Drain-source voltage Uds [V]: 55V. Drain Current Id [A] @ 25°C: 2.8A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: FL024N. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.075 Ohms @ 2.8A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 8.1 ns. Switch-off delay tf[nsec.]: 22 ns. Ciss Gate Capacitance [pF]: 400pF. Maximum dissipation Ptot [W]: 2.1W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, PCB soldering (SMD), SOT-223, 100V, 1.5A. Housing: PCB soldering (SMD). Housing: SOT-223. Drain-source voltage Uds [V]: 100V. Drain Current Id [A] @ 25°C: 1.5A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: FL110. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.25 Ohms @ 10A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 6.9ns. Switch-off delay tf[nsec.]: 15 ns. Ciss Gate Capacitance [pF]: 180pF. Maximum dissipation Ptot [W]: 3.1W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 0.6A, 0.96A, 250uA, 1.5 Ohms, SOT-223 ( TO-226 ), SOT-223, 200V. ID (T=100°C): 0.6A. ID (T=25°C): 0.96A. Idss (max): 250uA. On-resistance Rds On: 1.5 Ohms. Housing: SOT-223 ( TO-226 ). Housing (according to data sheet): SOT-223. Voltage Vds(max): 200V. C(in): 140pF. Cost): 53pF. Channel type: N. Drain-source protection : diode. Quantity per case: 1. Trr Diode (Min.): 150 ns. Type of transistor: MOSFET. Id(imp): 7.7A. IDss (min): 25uA. Note: screen printing/SMD code FC. Marking on the case: FC. Number of terminals: 4. Pd (Power Dissipation, Max): 3.1W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Td(off): 14 ns. Td(on): 8.2 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+150°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 4 v. Vgs(th) min.: 2V. G-S Protection: no

N-channel transistor, PCB soldering (SMD), SOT-223, 200V, 0.96A. Housing: PCB soldering (SMD). Housing: SOT-223. Drain-source voltage Uds [V]: 200V. Drain Current Id [A] @ 25°C: 0.96A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: FC. Drain current through resistor Rds [Ohm] @ Ids [A]: 1.5 Ohms @ 0.58A. Gate breakdown voltage Ugs [V]: 4 v. Switch-on time ton [nsec.]: 8.2 ns. Switch-off delay tf[nsec.]: 14 ns. Ciss Gate Capacitance [pF]: 140pF. Maximum dissipation Ptot [W]: 3.1W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C