Heat sinks

RoHS: yes. Component family: heatsink. Configuration: rectangular. Outer length [mm]: 26.13mm. Outer width [mm]: 12.7mm. External height [mm]: 10.16mm. Thermal resistance (K/W): 18K/W. Material: Aluminium. Surface: anodized, natural

RoHS: yes. Component family: Heatsink for standard enclosures. Manufacturer's product group: AKK127. Configuration: oval. Outer length [mm]: 40mm. Outer width [mm]: 27mm. External height [mm]: 12.7mm. Thermal resistance (K/W): 14K/W. Material: Aluminium. Surface: anodized, black

RoHS: yes. Component family: Heatsink for standard enclosures. Manufacturer's product group: AKK191. Configuration: oval. Outer length [mm]: 40mm. Outer width [mm]: 27mm. External height [mm]: 19.1mm. Thermal resistance (K/W): 12K/W. Material: Aluminium. Surface: anodized, black

RoHS: no. Component family: Accessory for heatsink. Manufacturer's product group: BSK

Function: 'Raspberry heatsink'. Dimensions: 40x30x5mm

Function: 'Raspberry heatsink'. Dimensions: 87x56x25.5mm

Material: Aluminium. Temperature factor: 30K/W. Configuration: anodized. Dimensions: 10x10x6mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 28.5K/W. Configuration: anodized. Dimensions: 10x10x10mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 29K/W. Configuration: anodized. Dimensions: 14x14x6mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 26K/W. Configuration: anodized. Dimensions: 19x19x10mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 20K/W. Configuration: anodized. Dimensions: 27x27x6mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 18.5K/W. Configuration: anodized. Dimensions: 27x27x10mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 18.6K/W. Configuration: anodized. Dimensions: 31x31x6mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Material: Aluminium. Temperature factor: 16.5K/W. Configuration: anodized. Dimensions: 35x35x6mm. Assembly/installation: by gluing. Color: black. Housing: BGA

Drilling diameter: 3.78mm. Temperature factor: 30K/W. Configuration: anodized. RoHS: yes. Assembly/installation: screw. Color: aluminum colored

Drilling diameter: 3.78mm. Temperature factor: 31K/W. Configuration: anodized. RoHS: yes. Assembly/installation: screw. Color: aluminum colored

Temperature factor: 47K/W. Configuration: anodized. RoHS: yes. Assembly/installation: PCB through-hole mounting. Color: black. Housing: DIP

Function: Heatsink for integrated circuit. Temperature factor: 11K/W. Configuration: anodized. RoHS: yes. Assembly/installation: PCB through-hole mounting. Color: black. Housing: DIP

Material: copper with tin coating. Function: SMD heatsink. Temperature factor: 25°C/W. Dimensions: 8.13x20.07x9.91mm. Assembly/installation: surface-mounted component (SMD). Housing: TO-252

Material: Aluminium. Drilling diameter: 3.78mm. Lenght: 19.5mm. Temperature factor: 30.2K/W. Configuration: anodized. Height/thickness: 6.35mm. RoHS: yes. Width: 13.21mm. Color: black

Function: Raspberry. Dimensions: 40x30x5mm

Material: Aluminium. Configuration: anodized. RoHS: yes

Material: Aluminium. Configuration: anodized

Temperature factor: 5.8K/W. Configuration: anodized. Color: black

Lenght: 13.3mm. Width: 19.1mm. Height: 12.7mm. Rth for 100mm°C/W: 21. Material Finish: Black Anodized. Applications: TO220. Material: AL