Zener diodes

Pd (Power Dissipation, Max): 0.5W. Housing: DO-35 ( SOD27 ). Housing (according to data sheet): DO-35. Zener voltage: 9.1V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: Zener diode. MRI (max): 2uA. MRI (min): 0.1uA. Equivalents: 1N5239B, BZX79C9V1, ZPD9.1. Number of terminals: 2. RoHS: yes. Assembly/installation: PCB through-hole mounting. Tolerance: 5%. Operating temperature: -65...+175°C. Threshold voltage Vf (max): 1.5V. Forward voltage Vf (min): 1.5V

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 5.1V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 2uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 400 Ohms @ 1mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Zener voltage: 62V. Semiconductor material: silicon. Number of terminals: 3. Dimensions: 2.9x1.5mm. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Zener voltage: 10V. Semiconductor material: silicon. Note: SI-Z SMD. Marking on the case: Z9. RoHS: yes. Pitch: 2.9x1.5mm. Assembly/installation: surface-mounted component (SMD)

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23. Zener voltage: 11V. Semiconductor material: silicon. Number of terminals: 3. RoHS: yes. Pitch: 2.9x1.5mm. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%. Operating temperature: -55...+150°C

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 11V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 0.1uA @ 8V. Zener Impedance Zzt[Ohm] @ Iz[A]: 20 Ohms @ 5mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 12V. Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). RoHS: yes. Tolerance: 5%. Operating temperature: -55...+150°C. VRRM: 12V. Cj: 130pF. Conditioning: roll. Conditioning unit: 3000. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SI-Z SMD. Marking on the case: Y2. Number of terminals: 3. Assembly/installation: surface-mounted component (SMD)

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( TO236 ). Zener voltage: 15V. Conditioning: roll. Conditioning unit: 3000. Quantity per case: 1. Semiconductor material: silicon. Marking on the case: Y4*. Equivalents: BZX84-C15.215. Number of terminals: 3. Dimensions: 2.9x1.5mm. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 18V. Conditioning: roll. Conditioning unit: 3000. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SI-Z SMD. Marking on the case: Y6. Number of terminals: 3. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 0.9V. Forward voltage Vf (min): 0.9V. VRRM: 18V

Housing: PCB soldering (SMD). Housing: SOT-23. Zener breakdown voltage Uz [V], nom.: 18V. Maximum dissipation Ptot [W]: 0.3W. RoHS: yes. Component family: 350mW (0.35W) zener diode. Surface Mounted Component (SMD). Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 0.05uA @ 12.6V. Zener Impedance Zzt[Ohm] @ Iz[A]: 45 Ohms @ 5mA. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 24V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 0.05uA @ 16.8V. Zener Impedance Zzt[Ohm] @ Iz[A]: 70 Ohms @ 5mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Pd (Power Dissipation, Max): 0.5W. Housing: SOD-123. Housing (according to data sheet): SOD123 ( 2.85x1.7mm ). Zener voltage: 27V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: Zener diode. Note: SI-Z SMD. MRI (max): 2uA. MRI (min): 0.1uA. Number of terminals: 2. Temperature: +150°C. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%. Operating temperature: +65°C...+150°C. Threshold voltage Vf (max): 0.9V. Forward voltage Vf (min): 0.9V

Pd (Power Dissipation, Max): 0.3W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 27V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SMD ZENER 27V. Number of terminals: 3. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 2.7V. Semiconductor material: silicon. Number of terminals: 3. RoHS: yes. Assembly/installation: surface-mounted component (SMD). VRRM: 2.7V

Zener Voltage Vz: 3.3V. Zener Current Iz: 97mA. Power: 0.25W. Mounting Type: SMD. Reverse Voltage/Leakage Current: 1V / 5uA. Tolerance: 5%. Impedance: 350 Ohms. Series: BZX84C

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 3.3V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 5uA @ 1V. Zener Impedance Zzt[Ohm] @ Iz[A]: 95 Ohms @ 5mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Pd (Power Dissipation, Max): 300mW. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23. Zener voltage: 3.6V. Semiconductor material: silicon. Number of terminals: 3. Dimensions: 2.9x1.3x1mm. RoHS: yes. Pitch: 1.9mm. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 3.9V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 3.9k Ohms. Zener Impedance Zzt[Ohm] @ Iz[A]: 90 Ohms @ 5mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Zener voltage: 4.7V. Semiconductor material: silicon. Number of terminals: 3. Dimensions: 2.9x1.5mm. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%

Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Zener breakdown voltage Uz [V], nom.: 4.7V. Maximum dissipation Ptot [W]: 0.25W. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD). Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 3uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 80 Ohms @ 5mA. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Zener breakdown voltage Uz [V], nom.: 5.1V. Maximum dissipation Ptot [W]: 0.3W. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Operating temperature range min (°C): -50°C. Operating temperature range max (°C): +150°C. Number of terminals: 3. Leakage current on closing Ir [A] @ Ur [V]: 2uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 60 Ohms @ 5mA. RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Configuration: surface-mounted component (SMD)

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 5.6V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SI-Z SMD. Number of terminals: 3. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Tolerance: 5%. VRRM: 5.6V

Pd (Power Dissipation, Max): 0.35W. Semiconductor material: silicon. Note: SOT-23. Note: SI-Z SMD. Pitch: 2.9x1.5mm. VRRM: 6V

Pd (Power Dissipation, Max): 0.35W. Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Zener voltage: 6.8V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Marking on the case: Y61. Number of terminals: 3. RoHS: yes. Assembly/installation: surface-mounted component (SMD). VRRM: 6.8V

Pd (Power Dissipation, Max): 0.35W. Semiconductor material: silicon. Note: SOT-23. Note: SI-Z SMD. Pitch: 2.9x1.5mm. VRRM: 7V