Out of stock
AG Termopasty
AG Termopasty EasyPrint Lead-Free SMD Solder Paste 20g Sn96.5Ag3Cu0.5 No Clean
Product reference : PPE-TIN2-E020G
Volume discounts — Save when you buy
| Quantity | Unit price | Save |
|---|---|---|
| 1 – 24 | 22.45 £ | — |
| 25+Best price | 21.95 £ | -2% |
Technical description of the product (PPE-TIN2-E020G):
EasyPrint SMD solder paste 20g SN:96.5% AG:3% CU:0.5%. Diameter: 28...45um. Eutectic: yes. Flux content: --. Soldering temperature (°C): +280...+410 °C. Function: SMD solder paste, lead-free. Chemical composition: Sn96.5%, Ag3%, Cu0.5%. Solidification point (°C): +217 °C. Melting point (°C): +217 °C. ROHS: yes. Cleaning free.