Soldering paste and flux

Diameter: 1mm. Eutectic: no. Solder flux capacity: 2%. Solder temperature: +250...+385°C. Note: Flux 2.0%. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 1kg

Diameter: 0.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 100g

Diameter: 0.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 100g

Diameter: 0.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 250g

Diameter: 0.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 500g

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.2%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb38/Cu2%. Solidification point (°C): +183°C. Melting point (°C): +187°C. Weight: 500g

Diameter: 0.7mm. Type: Lead free. Eutectic: yes. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +280...+410°C. Chemical composition: Sn96.3/Ag3.7%. Solidification point (°C): +221°C. Melting point (°C): +221°C. RoHS: yes. Weight: 250g. Standard: EN29454

Diameter: 0.5mm. Type: Lead free. Eutectic: yes. Solder flux capacity: 3%/3/1.1.3.. Solder temperature: +280...+410°C. Chemical composition: Sn96.3/Ag3.7%. Solidification point (°C): +221°C. Melting point (°C): +221°C. RoHS: yes. Weight: 500g. Standard: EN29454

Diameter: 0.7mm. Type: Lead free. Eutectic: yes. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +280...+410°C. Chemical composition: Sn96.3/Ag3.7%. Solidification point (°C): +221°C. Melting point (°C): +221°C. RoHS: yes. Weight: 500g. Standard: EN29454

Diameter: 1.5mm. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Chemical composition: Sn99.3/Cu0.7%. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Spec info: lead-free, does not require cleaning. Weight: 1kg. Standard: PN EN 29453--2000

Diameter: 0.5mm. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Chemical composition: Sn99.3/Cu0.7%. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Spec info: lead-free, does not require cleaning. Weight: 500g. Standard: PN EN 29453--2000

Diameter: 0.7mm. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Chemical composition: Sn99.3/Cu0.7%. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Spec info: lead-free, does not require cleaning. Weight: 500g. Standard: PN EN 29453--2000

Diameter: 1mm. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Chemical composition: Sn99.3/Cu0.7%. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Spec info: lead-free, does not require cleaning. Weight: 500g. Standard: PN EN 29453--2000

Diameter: 1mm. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Chemical composition: Sn99.3/Cu0.7%. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Spec info: lead-free, does not require cleaning. Weight: 14g. Standard: PN EN 29453--2000

RoHS: yes. Component family: Soldering resin. Manufacturer's product group: Ts

RoHS: yes. Manufacturer's product group: Ts

ROHS: Yes

Dimensions: 65x50mm