Miscellaneous integrated circuits

Conditioning: roll. Conditioning unit: 3000. Function: Single-Cell, Fully Integrated Li-Ion, Li-Polymer. Note: screen printing/SMD code KGNN. Marking on the case: KGNN. Number of terminals: 5. RoHS: yes. Spec info: Tri-State Output. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23-5. Housing (according to data sheet): SOT-23-5. Operating temperature: -40...+85°C. VCC: 3.75...6V

Conditioning: roll. Conditioning unit: 3000. Function: Single-Cell, Fully Integrated Li-Ion, Li-Polymer. Note: screen printing/SMD code KJNN. Marking on the case: KJNN. Number of terminals: 5. RoHS: yes. Spec info: Tri-State Output. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23-5. Housing (according to data sheet): SOT-23-5. Operating temperature: -40...+85°C. VCC: 3.75...6V

Conditioning: roll. Conditioning unit: 3000. Function: Linear Li-Ion/Li-Polymer Charge Controller. Note: screen printing/SMD code 833AMI. Note: charging current 1A (max 1.2A). Note: charging voltage 4.2V. Note: Timer Period 0 hours. Marking on the case: 833AMI. Equivalents: MCP73833T-AMI/UN. Number of terminals: 10. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: MSOP. Housing (according to data sheet): MSOP-10. Operating temperature: -40...+85°C. VCC: 3.75...6V. Supply voltage: 7V

Conditioning: roll. Conditioning unit: 3000. Function: Linear Li-Ion/Li-Polymer Charge Controller. Note: screen printing/SMD code 833FCI. Note: charging current 1A (max 1.2A). Note: charging voltage 4.2V. Note: Timer Period 6 hours. Marking on the case: 833FCI. Number of terminals: 10. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: MSOP. Housing (according to data sheet): MSOP-10. Operating temperature: -40...+85°C. VCC: 3.75...6V. Supply voltage: 7V

Note: 1.8V - 5.5V. Note: Unique ID and Battery Switch over. Note: I2C Real-Time Clock/Calendar with EEPROM, SRAM. Number of terminals: 8. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-8. Operating temperature: -40...+85°C

Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-18. ROHS: yes

Number of terminals: 24. RoHS: yes. Assembly/installation: surface-mounted component (SMD)

Number of terminals: 14. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-14. Operating temperature: -40...+125°C

Number of terminals: 8. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-8. Operating temperature: -40...+125°C

Number of terminals: 8. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-8

Function: Hi-Voltage Hi-Current Source Driver Array. Output current (max): 500mA. Number of terminals: 18. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-18. Operating temperature: -40...+85°C. VCC: 5...50V. Supply voltage: 50V. Vin input voltage (max): 30 v

Note: replacement previous version MIC502BM. Number of terminals: 8. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-8. Operating temperature: -40...+85°C

Function: temperature control (heater, fan), 4V...13.2V. Note: replacement previous version MIC502BN. Number of terminals: 8. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-8. Operating temperature: -40...+85°C

Note: BiMOS II Unipolar. Note: 4/8-Bit parallel-input. Number of terminals: 24. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-24

Note: BiMOS II Unipolar. Note: 8-Bit Serial-input. Number of terminals: 18. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-18

Note: BiMOS II Unipolar. Note: 8-Bit Serial-input. Number of terminals: 18. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-18

Note: BIMOS. Note: 8-Bit Serial-Input Latched Source Driver. Number of terminals: 18. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-18

Note: BIMOS. Note: 8-Bit Serial-Input Latched Source Driver. Number of terminals: 18. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-18

Frequency range: 300...450 MHz. Number of terminals: 6. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23-6. Operating temperature: -40...+85°C. Supply voltage: 1.8...3.6V

Note: current limit 500mA, Rds 15 Ohms. Note: oscillator frequency 100kHz. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: D2PAK ( TO-263 ). Housing (according to data sheet): D2PAK ( TO-263 )

Note: current limit 500mA, Rds 15 Ohms. Note: oscillator frequency 100kHz. Assembly/installation: PCB through-hole mounting. Housing: TO-220. Housing (according to data sheet): TO-220

Note: oscillator frequency 100kHz. Assembly/installation: PCB through-hole mounting. Housing: TO-220. Housing (according to data sheet): TO-220

Note: current limit 1.62A. Note: Rds-on 4.5 Ohms. Note: oscillator frequency 100kHz

Note: current limit 1A. Note: Rds-on 8.5 Ohms. Note: Vc 10V. Number of terminals: 3. Assembly/installation: PCB through-hole mounting. Housing: TO-220. Housing (according to data sheet): TO-220A